- Home＞
- Other division
This device is small, cannot correspond with the router or the press division method when the division position This divice is small and when the division position has a lot of substrates like V Ditch and the two sides mounthing substrates etc, it cannot correspond with the router or the press division method. The operation of device is divided firstly into the strip of paper,and divided into piece next by the automatic operation.
| Mounting substrate size | Max 120x150mm |
|---|---|
| Substrate thickness | 0.8-1.2mm |
| Minimum piece size | 10x10mm |
| Applied material | Glass Epoxy、Composit,Paper Phenol |
| Mounting Parts Height | Both Size Maximum 4mm |
Part heated to a light ceramic sheet by the laser irradiation and it will divide in high speed comparatively
We are preparing to corresponse with the user`s intention with accept only a basically divided function with dust adhension.
Desktop Type
In case of dividing 2 pieces,the 2axes in back&forth and left&right are not necessary,can be divided only back&forth of axis.
Batch type and in-line type
Maximum Substrate Size 150x200mm
Minimum Substrate Size 80x100mm
